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IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 2026

Event DatesSept. 09 - 11, 2026Duration: 3 days
City & CountryChiba, Japan
Designated VenueMakuhari Messe - Nippon Conventi
Target AudienceTrade Public
Official Event Website

About the Exhibition

Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging...

Classified Sectors:
Electronic Design & ComponentsMeasurement, Control & Testing
Exhibitor IntelligenceTriple Verified

Confirmed Exhibitor Intelligence Roster

Preview of confirmed exhibiting brands requiring stand construction, AV, and event marketing for IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 2026.

Exhibiting CompanyOriginRegistered SpaceDecision-Maker Contact
Nordic Architectural Façades
Sweden
125 sqm Custom Heavyweight Island
Head of Trade Fair Marketing (Protected)
SmartBuilding Automation Solutions
Germany
90 sqm Double-Deck Stand
Director of Brand Communications (Protected)
Japan Structural Glass & Steel
Japan
80 sqm Corner Stand
VP Global Business Development (Protected)

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Venue & Logistics

Makuhari Messe - Nippon Convention Center

Nakase 2-1, Mihama-ku, Chiba City 261-0023

Official Organizer

RX Japan

18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - ku, Tokyo 163-0570, Japan

Official Event Desk

Stand Contractor Advantage
  • 6–10 months advance notice
  • Decision-maker direct reach
  • 100% verified deliverable emails
Event Dossier Insights

Frequently Asked Questions About IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 2026

Key logistics and contractor intelligence guidelines for this trade fair.

IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 2026 is scheduled from Sept. 09 - 11, 2026 to 2026-09-11 in Chiba, Japan.
IC & SENSOR PACKAGING EXPO JAPAN - CHIBA 20262026-09-09 • Chiba, Japan