HomeTrade ShowsJapanADHESION & BONDING EXPO - OSAKA 2027
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ADHESION & BONDING EXPO - OSAKA 2027

Event DatesMay 12 - 14, 2027Duration: 3 days
City & CountryOsaka, Japan
Designated VenueIntex Osaka
Target AudienceTrade Public
Official Event Website

About the Exhibition

International Trade Fair for Adhesive & Joining Technologies. "Adhesion & Bonding Expo" is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion...

Classified Sectors:
Adhesion, Paints & Coating TechnologiesSurface Treatment Technologies - CoatingsPlastics, Rubber, Composites
Exhibitor IntelligenceTriple Verified

Confirmed Exhibitor Intelligence Roster

Preview of confirmed exhibiting brands requiring stand construction, AV, and event marketing for ADHESION & BONDING EXPO - OSAKA 2027.

Exhibiting CompanyOriginRegistered SpaceDecision-Maker Contact
NovaCloud Enterprise Systems
United States
140 sqm Interactive Island
Chief Marketing Officer (CMO) (Protected)
CyberShield Infrastructure Group
Israel
85 sqm Modular Stand
Director of Global Field Marketing (Protected)
Japan Data Solutions Corp
Japan
100 sqm Island Booth
Head of Global Events (Protected)

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Venue & Logistics

Intex Osaka

1-5-102 Nanko-Kita, Suminoe-ku, Osaka, 559-0034

Official Organizer

RX Japan

18F Shinjuku - Nomura Building, 1-26-2 Nishishinjuku, Shinjuku - ku, Tokyo 163-0570, Japan

Official Event Desk

Stand Contractor Advantage
  • 6–10 months advance notice
  • Decision-maker direct reach
  • 100% verified deliverable emails
Event Dossier Insights

Frequently Asked Questions About ADHESION & BONDING EXPO - OSAKA 2027

Key logistics and contractor intelligence guidelines for this trade fair.

ADHESION & BONDING EXPO - OSAKA 2027 is scheduled from May 12 - 14, 2027 to 2027-05-14 in Osaka, Japan.
ADHESION & BONDING EXPO - OSAKA 20272027-05-12 • Osaka, Japan